Integrated circuit package



FIG. 1 is a front elevational view of an integrated circuit packageshowing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a perspective view thereof.

The broken lines shown on the integrated circuit package form no part ofthe claimed design.

CLAIM The ornamental design for an integrated circuit package, as shownand described.